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News of Wingtech

Wingtech Technology Lauched TWS SiP Earphone Product

2021-09-23

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Recently, Wingtech Technology TWS SiP earphone successfully entered the trial production stage. This is the first trial production product since Nexperia (China) Co., Ltd., a wholly-owned subsidiary of Wingtech Technology, held the SiP product launching ceremony on September 4 and announced the successful launch of Nexperia TWS, 5G PA, IoT module and other SiP products; It is also another achievement of Wingtech's continuous expansion of business boundaries from mobile phone ODM to tablet, laptop, IoT, intelligent hardware, server and other fields.

In recent years, consumer electronics have become more and more digital, wireless and better user experience. TWS (true wireless stereo) headphones, as an important wearing product of IoT, have been widely used. By 2024, TWS needs nearly 600 million to 1 billion sets. With the popularity of TWS in the majority of consumer groups, it brings convenience to users. At the same time, higher user needs appears, such as more comfortable to wear, longer endurance, more powerful function, more durable reliability, etc.

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Since Apple's Airpods Pro adopted the SiP scheme, the advantages brought by the SiP scheme TWS have been recognized by the majority of users, and the market demand for the introduction of SiP technology has become stronger and stronger. The 5G mobile phone replacement trend has driven the rapid growth of SiP demand. For TWS, the integration of highly integrated SiP into headphones will become a new creative trend.

As the key technology to realize ultra-high density and multi-function integration in the post Moore era, SiP technology plays an important role in 5G, artificial intelligence, data center, high-performance computing and other fields. The product application scenarios using SiP technology include TWS headphones, smart watches, smart glasses and other wearable devices.

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Since Wingtech Technology established TWS earphone division in 2020, it has continuously increased investment and gradually formed a complete TWS development system and talent team; As a world-famous communication product integration enterprise and semiconductor IDM company, it has formed a whole industry chain layout integrating chip design, wafer manufacturing, assembly and test, terminal product R&D and manufacturing. The first self-developed SiP scheme TWS product will be introduced to the market in the fourth quarter of 2021.

Tao Yuanxiong, head of Wingtech Technology communication business BG3 TWS division, mentioned: "With the intensification of the competition in the market, competing in price is difficult for us to make profits, and product innovation is imperative. Wingtech, while paying attention to the needs and pain points of end users, pushes through the old and brings forth the new, relying on the ability of Nexperia, cooperates with the two basic platform departments of Academia Sinica and Automation Research Institute, with the help of SiP technology, combined with big data research, simulation, wearable trial and other technical methods, we are dedicated to providing users with TWS SiP product experience with higher cost efficiency.


TWS product empowered by SiP technology will have the following advantages:

l  Flexible packaging device

l  Flash encapsulation is optional, which can flexibly meet the needs of user data space

l  Smaller xyz size, providing more space for sound cavity, battery, sensor, RF, etc.

l  Lighter, insensible wear

l  ID design is less limited and provides more freedom to design for wearing comfort

l  Better reliability and stability

l  Shorter development cycle


Nexperia, a subsidiary of Wingtech Technology, is a global leading semiconductor IDM company. Headquartered in Nijmegen, the Netherlands, its product portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFET devices, gallium nitride field effect transistors (GaN FETs), analog ICs and logic ICs. It can deliver more than 90 billion products every year, which meet the stringent standards of the automotive industry. Its products are widely recognized in the industry in terms of efficiency (such as process, size, power and performance). It has advanced small-size packaging technology, which can effectively save power consumption and space.

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Wingtech Technology makes use of its own industrial chain advantages, adopts advanced SiP assembly and test technology, exquisite R&D and automatic production line manufacturing to provide users with excellent TWS products; At the same time, in the continuation of product development, it has been envisaged that other sensors can be integrated and synthesized. On the premise of improving sound quality, TWS products can be made into multifunctional portable carriers!

Wing Zhang, chairman of Wingtech Technology, Commented:"The strategy of Wingtech is divided into three stages: the first stage, the field of ODM system integration from the consumer field to the industry, IoT field, automotive electronics field product expansion, more products, more customers, greater sales, making ODM business into a powerful hardware traffic platform. In the second stage, Wingtech will accelerate vertical integration. Through merger and acquisition, integration and self-development, Wingtech will integrate and develop more components in the field of semiconductor and components, so as to increase our own supply capacity and form a safe and controllable supply system. In the third stage, Wingtech will take semiconductor as the leader, increase investment, enhance innovation ability, enable components and system integration, comprehensively enhance the core competitiveness of the whole machine products, provide customers with products that no one else has, and establish the moat of the company. Our goal is to promote the strategic transformation of Wingtech from the Professional Solution Company to a Great Product Company."


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